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Title: Nanolaminated Al2O3/HfO2 dielectrics for silicon carbide based devices
(Submitted on 23 Apr 2020 (v1), last revised 28 Apr 2021 (this version, v3))
Abstract: Nanolaminated Al2O3/HfO2 thin films as well as single Al2O3 and HfO2 layers have been grown as gate dielectrics by Plasma Enhanced Atomic Layer Deposition (PEALD) technique on silicon carbide (4H-SiC) substrates. All the three dielectric films have been deposited at temperature as low as 250{\deg}C, with a total thickness of about 30 nm and in particular, the nanolaminated Al2O3/HfO2 films have been fabricated by alternating nanometric Al2O3 and HfO2 layers. The structural characteristics and dielectrical properties of the nanolaminated Al2O3/HfO2 films have been evaluated and compared to those of the parent Al2O3 and HfO2 single layers. Moreover, the structural properties and their evolution upon annealing treatment at 800{\deg}C have been investigated as preliminar test for their possible implementation in the device fabrication flow-chart. On the basis of the collected data, the nanolaminated films demonstrated to possess promising dielectric behavior with respect to the simple oxide layers.
Submission history
From: Fabrizio Roccaforte [view email][v1] Thu, 23 Apr 2020 06:10:47 GMT (485kb)
[v2] Tue, 5 May 2020 06:01:00 GMT (485kb)
[v3] Wed, 28 Apr 2021 09:55:58 GMT (1130kb)
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