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Condensed Matter > Materials Science

Title: Temperature-Dependent Resistivity of Alternative Metal Thin Films

Abstract: The temperature coefficients of the resistivity (TCR) of Cu, Ru, Co, Ir, and W thin films have been investigated as a function of film thickness below 10 nm. Ru, Co, and Ir show bulk-like TCR values that are rather independent of the thickness whereas the TCR of Cu increases strongly with decreasing thickness. Thin W films show negative TCR values, which can be linked to high disorder. The results are qualitatively consistent with a temperature-dependent semiclassical thin film resistivity model that takes into account phonon, surface, and grain boundary scattering.
Comments: 11 pages, 4 figures
Subjects: Materials Science (cond-mat.mtrl-sci)
Journal reference: Applied Physics Letters 117, 043104 (2020)
DOI: 10.1063/5.0015048
Cite as: arXiv:2004.13854 [cond-mat.mtrl-sci]
  (or arXiv:2004.13854v3 [cond-mat.mtrl-sci] for this version)

Submission history

From: Christoph Adelmann [view email]
[v1] Tue, 28 Apr 2020 21:20:43 GMT (1767kb,D)
[v2] Sun, 24 May 2020 11:58:35 GMT (1767kb,D)
[v3] Thu, 2 Jul 2020 13:19:42 GMT (1783kb,D)

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