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Condensed Matter > Materials Science

Title: A thermo-mechanical phase-field fracture model: application to hot cracking simulations in additive manufacturing

Abstract: Thermal fracture is prevalent in many engineering problems and is one of the most devastating defects in metal additive manufacturing. Due to the interactive underlying physics involved, the computational simulation of such a process is challenging. In this work, we propose a thermo-mechanical phase-field fracture model, which is based on a thermodynamically consistent derivation. The influence of different coupling terms such as damage-informed thermomechanics and heat conduction and temperature-dependent fracture properties, as well as different phase-field fracture formulations, are discussed. Finally, the model is implemented in the finite element method and applied to simulate the hot cracking in additive manufacturing. Thereby not only the thermal strain but also the solidification shrinkage are considered. As for thermal history, various predicted thermal profiles, including analytical solution and numerical thermal temperature profile around the melting pool, are regarded, whereas the latter includes the influence of different process parameters. The studies reveal that the solidification shrinkage strain takes a dominant role in the formation of the circumferential crack, while the temperature gradient is mostly responsible for the central crack. Process parameter study demonstrates further that a higher laser power and slower scanning speed are favorable for keyhole mode hot cracking while a lower laser power and quicker scanning speed tend to form the conduction mode cracking. The numerical predictions of the hot cracking patterns are in good agreement with similar experimental observations, showing the capability of the model for further studies.
Subjects: Materials Science (cond-mat.mtrl-sci)
Cite as: arXiv:2208.02336 [cond-mat.mtrl-sci]
  (or arXiv:2208.02336v1 [cond-mat.mtrl-sci] for this version)

Submission history

From: Yangyiwei Yang [view email]
[v1] Wed, 3 Aug 2022 20:28:26 GMT (33074kb,D)

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