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Condensed Matter > Other Condensed Matter

Title: Modeling of the Peeling Process of Pressure-sensitive Adhesive Tapes with the Combination of Maxwell Elements

Abstract: A simple model for the peeling process of pressure-sensitive adhesive tape is presented. The model consists of linear springs and dashpots and can be solved analytically. Based on the modeling, the curved profile of the peeling tape is spontaneously determined in terms of viscoelastic properties of adhesives. Using this model, two experimental results are discussed: critical peel rates in the peel force and the peel rate dependence of the detachment process of adhesive from the substrate.
Comments: 17 pages, 10 figures
Subjects: Other Condensed Matter (cond-mat.other)
DOI: 10.1143/JPSJ.73.2135
Cite as: arXiv:cond-mat/0406746 [cond-mat.other]
  (or arXiv:cond-mat/0406746v1 [cond-mat.other] for this version)

Submission history

From: Katsuhiko Sato [view email]
[v1] Wed, 30 Jun 2004 04:20:59 GMT (220kb)

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