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Physics > Applied Physics

Title: Construct Particle-Packed Configuration Enable Excellent Thermal Insulation Performance

Abstract: The nanoparticle packed bed (NPB) as a kind of promising thermal insulation materials has drawn widely concern because of their quite low thermal conductivities (k). In this paper, based on the concept that NPB morphology enable low k, we further proposed a common method, a hybrid strategy, to further reduce k and enhance mechanical strength, simultaneously. The lowest effective thermal conductivity (k_e) of hybrid NPB can even as low as 0.018Wm-1K-1, which is much lower than the k of the free air and most common thermal insulation materials, due to the quite low solid-phase thermal conductivity (k_s), negligible thermal conductivity of the confined air (k_a) and small radiative thermal conductivity (k_r). Neglecting the k_a, the minimum k_e occurs at the porosity where domination role changes from k_s to k_r. In addition, an excellent mechanical strength, nearly 40-50 % compared to bulk silica, was also harvested in silica hybrid NPB. This study is expected to supply some information for thermal insulation material design.
Subjects: Applied Physics (physics.app-ph); Soft Condensed Matter (cond-mat.soft)
Cite as: arXiv:2001.04602 [physics.app-ph]
  (or arXiv:2001.04602v1 [physics.app-ph] for this version)

Submission history

From: Congliang Huang [view email]
[v1] Tue, 14 Jan 2020 03:09:16 GMT (1533kb)

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