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Quantum Physics

Title: 3D integration and packaging for solid-state qubits

Authors: D. Rosenberg, S. Weber, D. Conway, D. Yost, J. Mallek, G. Calusine, R. Das, D. Kim, M. Schwartz, W. Woods, J. L. Yoder, W. D. Oliver
(Submitted on 26 Jun 2019 (v1), last revised 24 Jul 2019 (this version, v2))
Abstract: Developing a packaging scheme that meets all of the requirements for operation of solid-state qubits in a cryogenic environment can be a formidable challenge. In this article, we discuss work being done in our group as well as in the broader community, focusing on the role of 3D integration and packaging in quantum processing with solid-state qubits.
Subjects: Quantum Physics (quant-ph); Superconductivity (cond-mat.supr-con)
Cite as: arXiv:1906.11146 [quant-ph]
  (or arXiv:1906.11146v2 [quant-ph] for this version)

Submission history

From: Danna Rosenberg [view email]
[v1] Wed, 26 Jun 2019 15:00:32 GMT (1012kb,D)
[v2] Wed, 24 Jul 2019 14:44:25 GMT (1013kb,D)
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